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Automatic Flip Chip Bonders Market, Global Outlook and Forecast 2022-2028

Automatic Flip Chip Bonders Market, Global Outlook and Forecast 2022-2028

Report Code: KNJ1406884 | No. of Pages: 74 | Category: Machinery And Equipments
Publisher: Market Monitor Global | Date of Publish: Sep-2022 
Flip chip die attach is a method for making electrical connections to a chip, where the chip is inverted and its bond pads are connected to a corresponding pattern of bond pads on a substrate.
This report contains market size and forecasts of Automatic Flip Chip Bonders in global, including the following market information:
Global Automatic Flip Chip Bonders Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Automatic Flip Chip Bonders Market Sales, 2017-2022, 2023-2028, (K Units)
Global top five Automatic Flip Chip Bonders companies in 2021 (%)
The global Automatic Flip Chip Bonders market was valued at US$ million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period 2022-2028.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Ultra-low load Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Automatic Flip Chip Bonders include BESI, ASMPT, Muehlbauer, K&S, Hamni, SET, Athlete FA, Toray and HiSOL, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Automatic Flip Chip Bonders manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Automatic Flip Chip Bonders Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Automatic Flip Chip Bonders Market Segment Percentages, by Type, 2021 (%)
    Ultra-low load
    Ultra-high load
Global Automatic Flip Chip Bonders Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Automatic Flip Chip Bonders Market Segment Percentages, by Application, 2021 (%)
    Industrial
    Construction
    Others
Global Automatic Flip Chip Bonders Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Automatic Flip Chip Bonders Market Segment Percentages, By Region and Country, 2021 (%)
    North America
        US
        Canada
        Mexico
    Europe
        Germany
        France
        U.K.
        Italy
        Russia
        Nordic Countries
        Benelux
        Rest of Europe
    Asia
        China
        Japan
        South Korea
        Southeast Asia
        India
        Rest of Asia
    South America
        Brazil
        Argentina
        Rest of South America
    Middle East & Africa
        Turkey
        Israel
        Saudi Arabia
        UAE
        Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Automatic Flip Chip Bonders revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Automatic Flip Chip Bonders revenues share in global market, 2021 (%)
Key companies Automatic Flip Chip Bonders sales in global market, 2017-2022 (Estimated), (K Units)
Key companies Automatic Flip Chip Bonders sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
    BESI
    ASMPT
    Muehlbauer
    K&S
    Hamni
    SET
    Athlete FA
    Toray
    HiSOL
    Advanced Techniques
    Finetech
    Yamaha Motor
1 Introduction to Research & Analysis Reports
    1.1 Automatic Flip Chip Bonders Market Definition
    1.2 Market Segments
        1.2.1 Market by Type
        1.2.2 Market by Application
    1.3 Global Automatic Flip Chip Bonders Market Overview
    1.4 Features & Benefits of This Report
    1.5 Methodology & Sources of Information
        1.5.1 Research Methodology
        1.5.2 Research Process
        1.5.3 Base Year
        1.5.4 Report Assumptions & Caveats
2 Global Automatic Flip Chip Bonders Overall Market Size
    2.1 Global Automatic Flip Chip Bonders Market Size: 2021 VS 2028
    2.2 Global Automatic Flip Chip Bonders Revenue, Prospects & Forecasts: 2017-2028
    2.3 Global Automatic Flip Chip Bonders Sales: 2017-2028
3 Company Landscape
    3.1 Top Automatic Flip Chip Bonders Players in Global Market
    3.2 Top Global Automatic Flip Chip Bonders Companies Ranked by Revenue
    3.3 Global Automatic Flip Chip Bonders Revenue by Companies
    3.4 Global Automatic Flip Chip Bonders Sales by Companies
    3.5 Global Automatic Flip Chip Bonders Price by Manufacturer (2017-2022)
    3.6 Top 3 and Top 5 Automatic Flip Chip Bonders Companies in Global Market, by Revenue in 2021
    3.7 Global Manufacturers Automatic Flip Chip Bonders Product Type
    3.8 Tier 1, Tier 2 and Tier 3 Automatic Flip Chip Bonders Players in Global Market
        3.8.1 List of Global Tier 1 Automatic Flip Chip Bonders Companies
        3.8.2 List of Global Tier 2 and Tier 3 Automatic Flip Chip Bonders Companies
4 Sights by Product
    4.1 Overview
        4.1.1 By Type - Global Automatic Flip Chip Bonders Market Size Markets, 2021 & 2028
        4.1.2 Ultra-low load
        4.1.3 Ultra-high load
    4.2 By Type - Global Automatic Flip Chip Bonders Revenue & Forecasts
        4.2.1 By Type - Global Automatic Flip Chip Bonders Revenue, 2017-2022
        4.2.2 By Type - Global Automatic Flip Chip Bonders Revenue, 2023-2028
        4.2.3 By Type - Global Automatic Flip Chip Bonders Revenue Market Share, 2017-2028
    4.3 By Type - Global Automatic Flip Chip Bonders Sales & Forecasts
        4.3.1 By Type - Global Automatic Flip Chip Bonders Sales, 2017-2022
        4.3.2 By Type - Global Automatic Flip Chip Bonders Sales, 2023-2028
        4.3.3 By Type - Global Automatic Flip Chip Bonders Sales Market Share, 2017-2028
    4.4 By Type - Global Automatic Flip Chip Bonders Price (Manufacturers Selling Prices), 2017-2028
5 Sights By Application
    5.1 Overview
        5.1.1 By Application - Global Automatic Flip Chip Bonders Market Size, 2021 & 2028
        5.1.2 Industrial
        5.1.3 Construction
        5.1.4 Others
    5.2 By Application - Global Automatic Flip Chip Bonders Revenue & Forecasts
        5.2.1 By Application - Global Automatic Flip Chip Bonders Revenue, 2017-2022
        5.2.2 By Application - Global Automatic Flip Chip Bonders Revenue, 2023-2028
        5.2.3 By Application - Global Automatic Flip Chip Bonders Revenue Market Share, 2017-2028
    5.3 By Application - Global Automatic Flip Chip Bonders Sales & Forecasts
        5.3.1 By Application - Global Automatic Flip Chip Bonders Sales, 2017-2022
        5.3.2 By Application - Global Automatic Flip Chip Bonders Sales, 2023-2028
        5.3.3 By Application - Global Automatic Flip Chip Bonders Sales Market Share, 2017-2028
    5.4 By Application - Global Automatic Flip Chip Bonders Price (Manufacturers Selling Prices), 2017-2028
6 Sights by Region
    6.1 By Region - Global Automatic Flip Chip Bonders Market Size, 2021 & 2028
    6.2 By Region - Global Automatic Flip Chip Bonders Revenue & Forecasts
        6.2.1 By Region - Global Automatic Flip Chip Bonders Revenue, 2017-2022
        6.2.2 By Region - Global Automatic Flip Chip Bonders Revenue, 2023-2028
        6.2.3 By Region - Global Automatic Flip Chip Bonders Revenue Market Share, 2017-2028
    6.3 By Region - Global Automatic Flip Chip Bonders Sales & Forecasts
        6.3.1 By Region - Global Automatic Flip Chip Bonders Sales, 2017-2022
        6.3.2 By Region - Global Automatic Flip Chip Bonders Sales, 2023-2028
        6.3.3 By Region - Global Automatic Flip Chip Bonders Sales Market Share, 2017-2028
    6.4 North America
        6.4.1 By Country - North America Automatic Flip Chip Bonders Revenue, 2017-2028
        6.4.2 By Country - North America Automatic Flip Chip Bonders Sales, 2017-2028
        6.4.3 US Automatic Flip Chip Bonders Market Size, 2017-2028
        6.4.4 Canada Automatic Flip Chip Bonders Market Size, 2017-2028
        6.4.5 Mexico Automatic Flip Chip Bonders Market Size, 2017-2028
    6.5 Europe
        6.5.1 By Country - Europe Automatic Flip Chip Bonders Revenue, 2017-2028
        6.5.2 By Country - Europe Automatic Flip Chip Bonders Sales, 2017-2028
        6.5.3 Germany Automatic Flip Chip Bonders Market Size, 2017-2028
        6.5.4 France Automatic Flip Chip Bonders Market Size, 2017-2028
        6.5.5 U.K. Automatic Flip Chip Bonders Market Size, 2017-2028
        6.5.6 Italy Automatic Flip Chip Bonders Market Size, 2017-2028
        6.5.7 Russia Automatic Flip Chip Bonders Market Size, 2017-2028
        6.5.8 Nordic Countries Automatic Flip Chip Bonders Market Size, 2017-2028
        6.5.9 Benelux Automatic Flip Chip Bonders Market Size, 2017-2028
    6.6 Asia
        6.6.1 By Region - Asia Automatic Flip Chip Bonders Revenue, 2017-2028
        6.6.2 By Region - Asia Automatic Flip Chip Bonders Sales, 2017-2028
        6.6.3 China Automatic Flip Chip Bonders Market Size, 2017-2028
        6.6.4 Japan Automatic Flip Chip Bonders Market Size, 2017-2028
        6.6.5 South Korea Automatic Flip Chip Bonders Market Size, 2017-2028
        6.6.6 Southeast Asia Automatic Flip Chip Bonders Market Size, 2017-2028
        6.6.7 India Automatic Flip Chip Bonders Market Size, 2017-2028
    6.7 South America
        6.7.1 By Country - South America Automatic Flip Chip Bonders Revenue, 2017-2028
        6.7.2 By Country - South America Automatic Flip Chip Bonders Sales, 2017-2028
        6.7.3 Brazil Automatic Flip Chip Bonders Market Size, 2017-2028
        6.7.4 Argentina Automatic Flip Chip Bonders Market Size, 2017-2028
    6.8 Middle East & Africa
        6.8.1 By Country - Middle East & Africa Automatic Flip Chip Bonders Revenue, 2017-2028
        6.8.2 By Country - Middle East & Africa Automatic Flip Chip Bonders Sales, 2017-2028
        6.8.3 Turkey Automatic Flip Chip Bonders Market Size, 2017-2028
        6.8.4 Israel Automatic Flip Chip Bonders Market Size, 2017-2028
        6.8.5 Saudi Arabia Automatic Flip Chip Bonders Market Size, 2017-2028
        6.8.6 UAE Automatic Flip Chip Bonders Market Size, 2017-2028
7 Manufacturers & Brands Profiles
    7.1 BESI
        7.1.1 BESI Corporate Summary
        7.1.2 BESI Business Overview
        7.1.3 BESI Automatic Flip Chip Bonders Major Product Offerings
        7.1.4 BESI Automatic Flip Chip Bonders Sales and Revenue in Global (2017-2022)
        7.1.5 BESI Key News
    7.2 ASMPT
        7.2.1 ASMPT Corporate Summary
        7.2.2 ASMPT Business Overview
        7.2.3 ASMPT Automatic Flip Chip Bonders Major Product Offerings
        7.2.4 ASMPT Automatic Flip Chip Bonders Sales and Revenue in Global (2017-2022)
        7.2.5 ASMPT Key News
    7.3 Muehlbauer
        7.3.1 Muehlbauer Corporate Summary
        7.3.2 Muehlbauer Business Overview
        7.3.3 Muehlbauer Automatic Flip Chip Bonders Major Product Offerings
        7.3.4 Muehlbauer Automatic Flip Chip Bonders Sales and Revenue in Global (2017-2022)
        7.3.5 Muehlbauer Key News
    7.4 K&S
        7.4.1 K&S Corporate Summary
        7.4.2 K&S Business Overview
        7.4.3 K&S Automatic Flip Chip Bonders Major Product Offerings
        7.4.4 K&S Automatic Flip Chip Bonders Sales and Revenue in Global (2017-2022)
        7.4.5 K&S Key News
    7.5 Hamni
        7.5.1 Hamni Corporate Summary
        7.5.2 Hamni Business Overview
        7.5.3 Hamni Automatic Flip Chip Bonders Major Product Offerings
        7.5.4 Hamni Automatic Flip Chip Bonders Sales and Revenue in Global (2017-2022)
        7.5.5 Hamni Key News
    7.6 SET
        7.6.1 SET Corporate Summary
        7.6.2 SET Business Overview
        7.6.3 SET Automatic Flip Chip Bonders Major Product Offerings
        7.6.4 SET Automatic Flip Chip Bonders Sales and Revenue in Global (2017-2022)
        7.6.5 SET Key News
    7.7 Athlete FA
        7.7.1 Athlete FA Corporate Summary
        7.7.2 Athlete FA Business Overview
        7.7.3 Athlete FA Automatic Flip Chip Bonders Major Product Offerings
        7.7.4 Athlete FA Automatic Flip Chip Bonders Sales and Revenue in Global (2017-2022)
        7.7.5 Athlete FA Key News
    7.8 Toray
        7.8.1 Toray Corporate Summary
        7.8.2 Toray Business Overview
        7.8.3 Toray Automatic Flip Chip Bonders Major Product Offerings
        7.8.4 Toray Automatic Flip Chip Bonders Sales and Revenue in Global (2017-2022)
        7.8.5 Toray Key News
    7.9 HiSOL
        7.9.1 HiSOL Corporate Summary
        7.9.2 HiSOL Business Overview
        7.9.3 HiSOL Automatic Flip Chip Bonders Major Product Offerings
        7.9.4 HiSOL Automatic Flip Chip Bonders Sales and Revenue in Global (2017-2022)
        7.9.5 HiSOL Key News
    7.10 Advanced Techniques
        7.10.1 Advanced Techniques Corporate Summary
        7.10.2 Advanced Techniques Business Overview
        7.10.3 Advanced Techniques Automatic Flip Chip Bonders Major Product Offerings
        7.10.4 Advanced Techniques Automatic Flip Chip Bonders Sales and Revenue in Global (2017-2022)
        7.10.5 Advanced Techniques Key News
    7.11 Finetech
        7.11.1 Finetech Corporate Summary
        7.11.2 Finetech Automatic Flip Chip Bonders Business Overview
        7.11.3 Finetech Automatic Flip Chip Bonders Major Product Offerings
        7.11.4 Finetech Automatic Flip Chip Bonders Sales and Revenue in Global (2017-2022)
        7.11.5 Finetech Key News
    7.12 Yamaha Motor
        7.12.1 Yamaha Motor Corporate Summary
        7.12.2 Yamaha Motor Automatic Flip Chip Bonders Business Overview
        7.12.3 Yamaha Motor Automatic Flip Chip Bonders Major Product Offerings
        7.12.4 Yamaha Motor Automatic Flip Chip Bonders Sales and Revenue in Global (2017-2022)
        7.12.5 Yamaha Motor Key News
8 Global Automatic Flip Chip Bonders Production Capacity, Analysis
    8.1 Global Automatic Flip Chip Bonders Production Capacity, 2017-2028
    8.2 Automatic Flip Chip Bonders Production Capacity of Key Manufacturers in Global Market
    8.3 Global Automatic Flip Chip Bonders Production by Region
9 Key Market Trends, Opportunity, Drivers and Restraints
    9.1 Market Opportunities & Trends
    9.2 Market Drivers
    9.3 Market Restraints
10 Automatic Flip Chip Bonders Supply Chain Analysis
    10.1 Automatic Flip Chip Bonders Industry Value Chain
    10.2 Automatic Flip Chip Bonders Upstream Market
    10.3 Automatic Flip Chip Bonders Downstream and Clients
    10.4 Marketing Channels Analysis
        10.4.1 Marketing Channels
        10.4.2 Automatic Flip Chip Bonders Distributors and Sales Agents in Global
11 Conclusion
12 Appendix
    12.1 Note
    12.2 Examples of Clients
    12.3 Disclaimer

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