Wafer Bonding Equipment Market, Global Outlook and Forecast 2023-2029
Report Code: KNJ1506225 No. of Pages: 78 Category: Technology
Publisher: Date of Publish:
Publisher: Date of Publish:
This report aims to provide a comprehensive presentation of the global market for Wafer Bonding Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Bonding Equipment. This report contains market size and forecasts of Wafer Bonding Equipment in global, including the following market information:
Global Wafer Bonding Equipment Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global Wafer Bonding Equipment Market Sales, 2018-2023, 2024-2029, (Units)
Global top five Wafer Bonding Equipment companies in 2022 (%)
The global Wafer Bonding Equipment market was valued at US$ 316.7 million in 2022 and is projected to reach US$ 461 million by 2029, at a CAGR of 5.5% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
Global key players of wafer bonding equipment include EV Group, SUSS MicroTec, Tokyo Electron, etc. Asia-Pacific is the largest producer of wafer bonding equipment, holds a share over 60%, followed by Europe, and North America. In terms of product, fully automatic is the largest segment, with a share over 80%. And in terms of application, the largest segment is MEMS, with a share about 40%.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Wafer Bonding Equipment manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Wafer Bonding Equipment Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (Units)
Global Wafer Bonding Equipment Market Segment Percentages, by Type, 2022 (%)
Fully Automatic
Semi Automatic
Global Wafer Bonding Equipment Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (Units)
Global Wafer Bonding Equipment Market Segment Percentages, by Application, 2022 (%)
MEMS
Advanced Packaging
CIS
Others
Global Wafer Bonding Equipment Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (Units)
Global Wafer Bonding Equipment Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Wafer Bonding Equipment revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Wafer Bonding Equipment revenues share in global market, 2022 (%)
Key companies Wafer Bonding Equipment sales in global market, 2018-2023 (Estimated), (Units)
Key companies Wafer Bonding Equipment sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
EV Group
SUSS MicroTec
Tokyo Electron
Applied Microengineering
Nidec Machinetool
Ayumi Industry
Shanghai Micro Electronics
U-Precision Tech
Hutem
Canon
Bondtech
TAZMO
TOK
Outline of Major Chapters:
Chapter 1: Introduces the definition of Wafer Bonding Equipment, market overview.
Chapter 2: Global Wafer Bonding Equipment market size in revenue and volume.
Chapter 3: Detailed analysis of Wafer Bonding Equipment manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Wafer Bonding Equipment in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Wafer Bonding Equipment capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
1 Introduction to Research & Analysis Reports
1.1 Wafer Bonding Equipment Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global Wafer Bonding Equipment Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global Wafer Bonding Equipment Overall Market Size
2.1 Global Wafer Bonding Equipment Market Size: 2022 VS 2029
2.2 Global Wafer Bonding Equipment Revenue, Prospects & Forecasts: 2018-2029
2.3 Global Wafer Bonding Equipment Sales: 2018-2029
3 Company Landscape
3.1 Top Wafer Bonding Equipment Players in Global Market
3.2 Top Global Wafer Bonding Equipment Companies Ranked by Revenue
3.3 Global Wafer Bonding Equipment Revenue by Companies
3.4 Global Wafer Bonding Equipment Sales by Companies
3.5 Global Wafer Bonding Equipment Price by Manufacturer (2018-2023)
3.6 Top 3 and Top 5 Wafer Bonding Equipment Companies in Global Market, by Revenue in 2022
3.7 Global Manufacturers Wafer Bonding Equipment Product Type
3.8 Tier 1, Tier 2 and Tier 3 Wafer Bonding Equipment Players in Global Market
3.8.1 List of Global Tier 1 Wafer Bonding Equipment Companies
3.8.2 List of Global Tier 2 and Tier 3 Wafer Bonding Equipment Companies
4 Sights by Product
4.1 Overview
4.1.1 By Type - Global Wafer Bonding Equipment Market Size Markets, 2022 & 2029
4.1.2 Fully Automatic
4.1.3 Semi Automatic
4.2 By Type - Global Wafer Bonding Equipment Revenue & Forecasts
4.2.1 By Type - Global Wafer Bonding Equipment Revenue, 2018-2023
4.2.2 By Type - Global Wafer Bonding Equipment Revenue, 2024-2029
4.2.3 By Type - Global Wafer Bonding Equipment Revenue Market Share, 2018-2029
4.3 By Type - Global Wafer Bonding Equipment Sales & Forecasts
4.3.1 By Type - Global Wafer Bonding Equipment Sales, 2018-2023
4.3.2 By Type - Global Wafer Bonding Equipment Sales, 2024-2029
4.3.3 By Type - Global Wafer Bonding Equipment Sales Market Share, 2018-2029
4.4 By Type - Global Wafer Bonding Equipment Price (Manufacturers Selling Prices), 2018-2029
5 Sights by Application
5.1 Overview
5.1.1 By Application - Global Wafer Bonding Equipment Market Size, 2022 & 2029
5.1.2 MEMS
5.1.3 Advanced Packaging
5.1.4 CIS
5.1.5 Others
5.2 By Application - Global Wafer Bonding Equipment Revenue & Forecasts
5.2.1 By Application - Global Wafer Bonding Equipment Revenue, 2018-2023
5.2.2 By Application - Global Wafer Bonding Equipment Revenue, 2024-2029
5.2.3 By Application - Global Wafer Bonding Equipment Revenue Market Share, 2018-2029
5.3 By Application - Global Wafer Bonding Equipment Sales & Forecasts
5.3.1 By Application - Global Wafer Bonding Equipment Sales, 2018-2023
5.3.2 By Application - Global Wafer Bonding Equipment Sales, 2024-2029
5.3.3 By Application - Global Wafer Bonding Equipment Sales Market Share, 2018-2029
5.4 By Application - Global Wafer Bonding Equipment Price (Manufacturers Selling Prices), 2018-2029
6 Sights by Region
6.1 By Region - Global Wafer Bonding Equipment Market Size, 2022 & 2029
6.2 By Region - Global Wafer Bonding Equipment Revenue & Forecasts
6.2.1 By Region - Global Wafer Bonding Equipment Revenue, 2018-2023
6.2.2 By Region - Global Wafer Bonding Equipment Revenue, 2024-2029
6.2.3 By Region - Global Wafer Bonding Equipment Revenue Market Share, 2018-2029
6.3 By Region - Global Wafer Bonding Equipment Sales & Forecasts
6.3.1 By Region - Global Wafer Bonding Equipment Sales, 2018-2023
6.3.2 By Region - Global Wafer Bonding Equipment Sales, 2024-2029
6.3.3 By Region - Global Wafer Bonding Equipment Sales Market Share, 2018-2029
6.4 North America
6.4.1 By Country - North America Wafer Bonding Equipment Revenue, 2018-2029
6.4.2 By Country - North America Wafer Bonding Equipment Sales, 2018-2029
6.4.3 US Wafer Bonding Equipment Market Size, 2018-2029
6.4.4 Canada Wafer Bonding Equipment Market Size, 2018-2029
6.4.5 Mexico Wafer Bonding Equipment Market Size, 2018-2029
6.5 Europe
6.5.1 By Country - Europe Wafer Bonding Equipment Revenue, 2018-2029
6.5.2 By Country - Europe Wafer Bonding Equipment Sales, 2018-2029
6.5.3 Germany Wafer Bonding Equipment Market Size, 2018-2029
6.5.4 France Wafer Bonding Equipment Market Size, 2018-2029
6.5.5 U.K. Wafer Bonding Equipment Market Size, 2018-2029
6.5.6 Italy Wafer Bonding Equipment Market Size, 2018-2029
6.5.7 Russia Wafer Bonding Equipment Market Size, 2018-2029
6.5.8 Nordic Countries Wafer Bonding Equipment Market Size, 2018-2029
6.5.9 Benelux Wafer Bonding Equipment Market Size, 2018-2029
6.6 Asia
6.6.1 By Region - Asia Wafer Bonding Equipment Revenue, 2018-2029
6.6.2 By Region - Asia Wafer Bonding Equipment Sales, 2018-2029
6.6.3 China Wafer Bonding Equipment Market Size, 2018-2029
6.6.4 Japan Wafer Bonding Equipment Market Size, 2018-2029
6.6.5 South Korea Wafer Bonding Equipment Market Size, 2018-2029
6.6.6 Southeast Asia Wafer Bonding Equipment Market Size, 2018-2029
6.6.7 India Wafer Bonding Equipment Market Size, 2018-2029
6.7 South America
6.7.1 By Country - South America Wafer Bonding Equipment Revenue, 2018-2029
6.7.2 By Country - South America Wafer Bonding Equipment Sales, 2018-2029
6.7.3 Brazil Wafer Bonding Equipment Market Size, 2018-2029
6.7.4 Argentina Wafer Bonding Equipment Market Size, 2018-2029
6.8 Middle East & Africa
6.8.1 By Country - Middle East & Africa Wafer Bonding Equipment Revenue, 2018-2029
6.8.2 By Country - Middle East & Africa Wafer Bonding Equipment Sales, 2018-2029
6.8.3 Turkey Wafer Bonding Equipment Market Size, 2018-2029
6.8.4 Israel Wafer Bonding Equipment Market Size, 2018-2029
6.8.5 Saudi Arabia Wafer Bonding Equipment Market Size, 2018-2029
6.8.6 UAE Wafer Bonding Equipment Market Size, 2018-2029
7 Manufacturers & Brands Profiles
7.1 EV Group
7.1.1 EV Group Company Summary
7.1.2 EV Group Business Overview
7.1.3 EV Group Wafer Bonding Equipment Major Product Offerings
7.1.4 EV Group Wafer Bonding Equipment Sales and Revenue in Global (2018-2023)
7.1.5 EV Group Key News & Latest Developments
7.2 SUSS MicroTec
7.2.1 SUSS MicroTec Company Summary
7.2.2 SUSS MicroTec Business Overview
7.2.3 SUSS MicroTec Wafer Bonding Equipment Major Product Offerings
7.2.4 SUSS MicroTec Wafer Bonding Equipment Sales and Revenue in Global (2018-2023)
7.2.5 SUSS MicroTec Key News & Latest Developments
7.3 Tokyo Electron
7.3.1 Tokyo Electron Company Summary
7.3.2 Tokyo Electron Business Overview
7.3.3 Tokyo Electron Wafer Bonding Equipment Major Product Offerings
7.3.4 Tokyo Electron Wafer Bonding Equipment Sales and Revenue in Global (2018-2023)
7.3.5 Tokyo Electron Key News & Latest Developments
7.4 Applied Microengineering
7.4.1 Applied Microengineering Company Summary
7.4.2 Applied Microengineering Business Overview
7.4.3 Applied Microengineering Wafer Bonding Equipment Major Product Offerings
7.4.4 Applied Microengineering Wafer Bonding Equipment Sales and Revenue in Global (2018-2023)
7.4.5 Applied Microengineering Key News & Latest Developments
7.5 Nidec Machinetool
7.5.1 Nidec Machinetool Company Summary
7.5.2 Nidec Machinetool Business Overview
7.5.3 Nidec Machinetool Wafer Bonding Equipment Major Product Offerings
7.5.4 Nidec Machinetool Wafer Bonding Equipment Sales and Revenue in Global (2018-2023)
7.5.5 Nidec Machinetool Key News & Latest Developments
7.6 Ayumi Industry
7.6.1 Ayumi Industry Company Summary
7.6.2 Ayumi Industry Business Overview
7.6.3 Ayumi Industry Wafer Bonding Equipment Major Product Offerings
7.6.4 Ayumi Industry Wafer Bonding Equipment Sales and Revenue in Global (2018-2023)
7.6.5 Ayumi Industry Key News & Latest Developments
7.7 Shanghai Micro Electronics
7.7.1 Shanghai Micro Electronics Company Summary
7.7.2 Shanghai Micro Electronics Business Overview
7.7.3 Shanghai Micro Electronics Wafer Bonding Equipment Major Product Offerings
7.7.4 Shanghai Micro Electronics Wafer Bonding Equipment Sales and Revenue in Global (2018-2023)
7.7.5 Shanghai Micro Electronics Key News & Latest Developments
7.8 U-Precision Tech
7.8.1 U-Precision Tech Company Summary
7.8.2 U-Precision Tech Business Overview
7.8.3 U-Precision Tech Wafer Bonding Equipment Major Product Offerings
7.8.4 U-Precision Tech Wafer Bonding Equipment Sales and Revenue in Global (2018-2023)
7.8.5 U-Precision Tech Key News & Latest Developments
7.9 Hutem
7.9.1 Hutem Company Summary
7.9.2 Hutem Business Overview
7.9.3 Hutem Wafer Bonding Equipment Major Product Offerings
7.9.4 Hutem Wafer Bonding Equipment Sales and Revenue in Global (2018-2023)
7.9.5 Hutem Key News & Latest Developments
7.10 Canon
7.10.1 Canon Company Summary
7.10.2 Canon Business Overview
7.10.3 Canon Wafer Bonding Equipment Major Product Offerings
7.10.4 Canon Wafer Bonding Equipment Sales and Revenue in Global (2018-2023)
7.10.5 Canon Key News & Latest Developments
7.11 Bondtech
7.11.1 Bondtech Company Summary
7.11.2 Bondtech Wafer Bonding Equipment Business Overview
7.11.3 Bondtech Wafer Bonding Equipment Major Product Offerings
7.11.4 Bondtech Wafer Bonding Equipment Sales and Revenue in Global (2018-2023)
7.11.5 Bondtech Key News & Latest Developments
7.12 TAZMO
7.12.1 TAZMO Company Summary
7.12.2 TAZMO Wafer Bonding Equipment Business Overview
7.12.3 TAZMO Wafer Bonding Equipment Major Product Offerings
7.12.4 TAZMO Wafer Bonding Equipment Sales and Revenue in Global (2018-2023)
7.12.5 TAZMO Key News & Latest Developments
7.13 TOK
7.13.1 TOK Company Summary
7.13.2 TOK Wafer Bonding Equipment Business Overview
7.13.3 TOK Wafer Bonding Equipment Major Product Offerings
7.13.4 TOK Wafer Bonding Equipment Sales and Revenue in Global (2018-2023)
7.13.5 TOK Key News & Latest Developments
8 Global Wafer Bonding Equipment Production Capacity, Analysis
8.1 Global Wafer Bonding Equipment Production Capacity, 2018-2029
8.2 Wafer Bonding Equipment Production Capacity of Key Manufacturers in Global Market
8.3 Global Wafer Bonding Equipment Production by Region
9 Key Market Trends, Opportunity, Drivers and Restraints
9.1 Market Opportunities & Trends
9.2 Market Drivers
9.3 Market Restraints
10 Wafer Bonding Equipment Supply Chain Analysis
10.1 Wafer Bonding Equipment Industry Value Chain
10.2 Wafer Bonding Equipment Upstream Market
10.3 Wafer Bonding Equipment Downstream and Clients
10.4 Marketing Channels Analysis
10.4.1 Marketing Channels
10.4.2 Wafer Bonding Equipment Distributors and Sales Agents in Global
11 Conclusion
12 Appendix
12.1 Note
12.2 Examples of Clients
12.3 Disclaimer
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