Wafer Bumping Market, Global Outlook and Forecast 2023-2029
Report Code: KNJ1507609 No. of Pages: 66 Category: Technology
Publisher: Date of Publish:
Publisher: Date of Publish:
Wafer bumping technology can provide significant performance, form factor and cost advantages in a semiconductor package. Wafer bumping is an advanced manufacturing process whereby metal solder balls or bumps are formed on the semiconductor wafer prior to dicing. Wafer bumps provide an interconnection between the die and a substrate or printed circuit board in a device. Solder bump composition and dimension depends on a number of factors such as form factor, cost and the electrical, mechanical and thermal performance requirements of the semiconductor device.
This report aims to provide a comprehensive presentation of the global market for Wafer Bumping, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Bumping. This report contains market size and forecasts of Wafer Bumping in global, including the following market information:
Global Wafer Bumping Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global top five companies in 2022 (%)
The global Wafer Bumping market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2022, While China is to reach $ Million.
Copper Pillar Bumping Segment to Reach $ Million by 2029, with a % CAGR in next six years.
The global key manufacturers of Wafer Bumping include Tianshui Huatian Technology, Chipbond, LB Semicon, KYEC and Union Semiconductor (Hefei), etc. in 2022, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Wafer Bumping companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Wafer Bumping Market, by Type, 2018-2023, 2024-2029 ($ millions)
Global Wafer Bumping Market Segment Percentages, by Type, 2022 (%)
Copper Pillar Bumping
Solder Bumping
Gold Bumping
Global Wafer Bumping Market, by Application, 2018-2023, 2024-2029 ($ millions)
Global Wafer Bumping Market Segment Percentages, by Application, 2022 (%)
4&6 Inch
8&12 Inch
Global Wafer Bumping Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions)
Global Wafer Bumping Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Wafer Bumping revenues in global market, 2018-2023 (estimated), ($ millions)
Key companies Wafer Bumping revenues share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Tianshui Huatian Technology
Chipbond
LB Semicon
KYEC
Union Semiconductor (Hefei)
Outline of Major Chapters:
Chapter 1: Introduces the definition of Wafer Bumping, market overview.
Chapter 2: Global Wafer Bumping market size in revenue.
Chapter 3: Detailed analysis of Wafer Bumping company competitive landscape, revenue and market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Wafer Bumping in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: The main points and conclusions of the report.
1 Introduction to Research & Analysis Reports
1.1 Wafer Bumping Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global Wafer Bumping Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global Wafer Bumping Overall Market Size
2.1 Global Wafer Bumping Market Size: 2022 VS 2029
2.2 Global Wafer Bumping Market Size, Prospects & Forecasts: 2018-2029
2.3 Key Market Trends, Opportunity, Drivers and Restraints
2.3.1 Market Opportunities & Trends
2.3.2 Market Drivers
2.3.3 Market Restraints
3 Company Landscape
3.1 Top Wafer Bumping Players in Global Market
3.2 Top Global Wafer Bumping Companies Ranked by Revenue
3.3 Global Wafer Bumping Revenue by Companies
3.4 Top 3 and Top 5 Wafer Bumping Companies in Global Market, by Revenue in 2022
3.5 Global Companies Wafer Bumping Product Type
3.6 Tier 1, Tier 2 and Tier 3 Wafer Bumping Players in Global Market
3.6.1 List of Global Tier 1 Wafer Bumping Companies
3.6.2 List of Global Tier 2 and Tier 3 Wafer Bumping Companies
4 Market Sights by Product
4.1 Overview
4.1.1 By Type - Global Wafer Bumping Market Size Markets, 2022 & 2029
4.1.2 Copper Pillar Bumping
4.1.3 Solder Bumping
4.1.4 Gold Bumping
4.2 By Type - Global Wafer Bumping Revenue & Forecasts
4.2.1 By Type - Global Wafer Bumping Revenue, 2018-2023
4.2.2 By Type - Global Wafer Bumping Revenue, 2024-2029
4.2.3 By Type - Global Wafer Bumping Revenue Market Share, 2018-2029
5 Sights by Application
5.1 Overview
5.1.1 By Application - Global Wafer Bumping Market Size, 2022 & 2029
5.1.2 4&6 Inch
5.1.3 8&12 Inch
5.2 By Application - Global Wafer Bumping Revenue & Forecasts
5.2.1 By Application - Global Wafer Bumping Revenue, 2018-2023
5.2.2 By Application - Global Wafer Bumping Revenue, 2024-2029
5.2.3 By Application - Global Wafer Bumping Revenue Market Share, 2018-2029
6 Sights by Region
6.1 By Region - Global Wafer Bumping Market Size, 2022 & 2029
6.2 By Region - Global Wafer Bumping Revenue & Forecasts
6.2.1 By Region - Global Wafer Bumping Revenue, 2018-2023
6.2.2 By Region - Global Wafer Bumping Revenue, 2024-2029
6.2.3 By Region - Global Wafer Bumping Revenue Market Share, 2018-2029
6.3 North America
6.3.1 By Country - North America Wafer Bumping Revenue, 2018-2029
6.3.2 US Wafer Bumping Market Size, 2018-2029
6.3.3 Canada Wafer Bumping Market Size, 2018-2029
6.3.4 Mexico Wafer Bumping Market Size, 2018-2029
6.4 Europe
6.4.1 By Country - Europe Wafer Bumping Revenue, 2018-2029
6.4.2 Germany Wafer Bumping Market Size, 2018-2029
6.4.3 France Wafer Bumping Market Size, 2018-2029
6.4.4 U.K. Wafer Bumping Market Size, 2018-2029
6.4.5 Italy Wafer Bumping Market Size, 2018-2029
6.4.6 Russia Wafer Bumping Market Size, 2018-2029
6.4.7 Nordic Countries Wafer Bumping Market Size, 2018-2029
6.4.8 Benelux Wafer Bumping Market Size, 2018-2029
6.5 Asia
6.5.1 By Region - Asia Wafer Bumping Revenue, 2018-2029
6.5.2 China Wafer Bumping Market Size, 2018-2029
6.5.3 Japan Wafer Bumping Market Size, 2018-2029
6.5.4 South Korea Wafer Bumping Market Size, 2018-2029
6.5.5 Southeast Asia Wafer Bumping Market Size, 2018-2029
6.5.6 India Wafer Bumping Market Size, 2018-2029
6.6 South America
6.6.1 By Country - South America Wafer Bumping Revenue, 2018-2029
6.6.2 Brazil Wafer Bumping Market Size, 2018-2029
6.6.3 Argentina Wafer Bumping Market Size, 2018-2029
6.7 Middle East & Africa
6.7.1 By Country - Middle East & Africa Wafer Bumping Revenue, 2018-2029
6.7.2 Turkey Wafer Bumping Market Size, 2018-2029
6.7.3 Israel Wafer Bumping Market Size, 2018-2029
6.7.4 Saudi Arabia Wafer Bumping Market Size, 2018-2029
6.7.5 UAE Wafer Bumping Market Size, 2018-2029
7 Wafer Bumping Companies Profiles
7.1 Tianshui Huatian Technology
7.1.1 Tianshui Huatian Technology Company Summary
7.1.2 Tianshui Huatian Technology Business Overview
7.1.3 Tianshui Huatian Technology Wafer Bumping Major Product Offerings
7.1.4 Tianshui Huatian Technology Wafer Bumping Revenue in Global Market (2018-2023)
7.1.5 Tianshui Huatian Technology Key News & Latest Developments
7.2 Chipbond
7.2.1 Chipbond Company Summary
7.2.2 Chipbond Business Overview
7.2.3 Chipbond Wafer Bumping Major Product Offerings
7.2.4 Chipbond Wafer Bumping Revenue in Global Market (2018-2023)
7.2.5 Chipbond Key News & Latest Developments
7.3 LB Semicon
7.3.1 LB Semicon Company Summary
7.3.2 LB Semicon Business Overview
7.3.3 LB Semicon Wafer Bumping Major Product Offerings
7.3.4 LB Semicon Wafer Bumping Revenue in Global Market (2018-2023)
7.3.5 LB Semicon Key News & Latest Developments
7.4 KYEC
7.4.1 KYEC Company Summary
7.4.2 KYEC Business Overview
7.4.3 KYEC Wafer Bumping Major Product Offerings
7.4.4 KYEC Wafer Bumping Revenue in Global Market (2018-2023)
7.4.5 KYEC Key News & Latest Developments
7.5 Union Semiconductor (Hefei)
7.5.1 Union Semiconductor (Hefei) Company Summary
7.5.2 Union Semiconductor (Hefei) Business Overview
7.5.3 Union Semiconductor (Hefei) Wafer Bumping Major Product Offerings
7.5.4 Union Semiconductor (Hefei) Wafer Bumping Revenue in Global Market (2018-2023)
7.5.5 Union Semiconductor (Hefei) Key News & Latest Developments
8 Conclusion
9 Appendix
9.1 Note
9.2 Examples of Clients
9.3 Disclaimer
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