Solder Ball Packaging Material Market, Global Outlook and Forecast 2023-2029
Report Code: KNJ1507865 No. of Pages: 77 Category: Technology
Publisher: Date of Publish:
Publisher: Date of Publish:
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.
Solder Ball are very small spheres of high-purity solder for micro soldering system. The most important advantages of Solder Ball are their very clean surfaces and exact solder quantity control. Most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.
This report aims to provide a comprehensive presentation of the global market for Solder Ball Packaging Material, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Solder Ball Packaging Material. This report contains market size and forecasts of Solder Ball Packaging Material in global, including the following market information:
Global Solder Ball Packaging Material Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global Solder Ball Packaging Material Market Sales, 2018-2023, 2024-2029, (Million Units)
Global top five Solder Ball Packaging Material companies in 2022 (%)
The global Solder Ball Packaging Material market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million.
Lead Solder Ball Segment to Reach $ Million by 2029, with a % CAGR in next six years.
The global key manufacturers of Solder Ball Packaging Material include Senju Metal, DS HiMetal, MKE, YCTC, Nippon Micrometal, Accurus, PMTC, Shanghai hiking solder material and Shenmao Technology, etc. in 2022, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Solder Ball Packaging Material manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Solder Ball Packaging Material Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (Million Units)
Global Solder Ball Packaging Material Market Segment Percentages, by Type, 2022 (%)
Lead Solder Ball
Lead Free Solder Ball
Global Solder Ball Packaging Material Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (Million Units)
Global Solder Ball Packaging Material Market Segment Percentages, by Application, 2022 (%)
BGA
CSP & WLCSP
Flip-Chip & Others
Global Solder Ball Packaging Material Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (Million Units)
Global Solder Ball Packaging Material Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Solder Ball Packaging Material revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Solder Ball Packaging Material revenues share in global market, 2022 (%)
Key companies Solder Ball Packaging Material sales in global market, 2018-2023 (Estimated), (Million Units)
Key companies Solder Ball Packaging Material sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Senju Metal
DS HiMetal
MKE
YCTC
Nippon Micrometal
Accurus
PMTC
Shanghai hiking solder material
Shenmao Technology
Indium Corporation
Jovy Systems
Outline of Major Chapters:
Chapter 1: Introduces the definition of Solder Ball Packaging Material, market overview.
Chapter 2: Global Solder Ball Packaging Material market size in revenue and volume.
Chapter 3: Detailed analysis of Solder Ball Packaging Material manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Solder Ball Packaging Material in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Solder Ball Packaging Material capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
1 Introduction to Research & Analysis Reports
1.1 Solder Ball Packaging Material Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global Solder Ball Packaging Material Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global Solder Ball Packaging Material Overall Market Size
2.1 Global Solder Ball Packaging Material Market Size: 2022 VS 2029
2.2 Global Solder Ball Packaging Material Revenue, Prospects & Forecasts: 2018-2029
2.3 Global Solder Ball Packaging Material Sales: 2018-2029
3 Company Landscape
3.1 Top Solder Ball Packaging Material Players in Global Market
3.2 Top Global Solder Ball Packaging Material Companies Ranked by Revenue
3.3 Global Solder Ball Packaging Material Revenue by Companies
3.4 Global Solder Ball Packaging Material Sales by Companies
3.5 Global Solder Ball Packaging Material Price by Manufacturer (2018-2023)
3.6 Top 3 and Top 5 Solder Ball Packaging Material Companies in Global Market, by Revenue in 2022
3.7 Global Manufacturers Solder Ball Packaging Material Product Type
3.8 Tier 1, Tier 2 and Tier 3 Solder Ball Packaging Material Players in Global Market
3.8.1 List of Global Tier 1 Solder Ball Packaging Material Companies
3.8.2 List of Global Tier 2 and Tier 3 Solder Ball Packaging Material Companies
4 Sights by Product
4.1 Overview
4.1.1 By Type - Global Solder Ball Packaging Material Market Size Markets, 2022 & 2029
4.1.2 Lead Solder Ball
4.1.3 Lead Free Solder Ball
4.2 By Type - Global Solder Ball Packaging Material Revenue & Forecasts
4.2.1 By Type - Global Solder Ball Packaging Material Revenue, 2018-2023
4.2.2 By Type - Global Solder Ball Packaging Material Revenue, 2024-2029
4.2.3 By Type - Global Solder Ball Packaging Material Revenue Market Share, 2018-2029
4.3 By Type - Global Solder Ball Packaging Material Sales & Forecasts
4.3.1 By Type - Global Solder Ball Packaging Material Sales, 2018-2023
4.3.2 By Type - Global Solder Ball Packaging Material Sales, 2024-2029
4.3.3 By Type - Global Solder Ball Packaging Material Sales Market Share, 2018-2029
4.4 By Type - Global Solder Ball Packaging Material Price (Manufacturers Selling Prices), 2018-2029
5 Sights by Application
5.1 Overview
5.1.1 By Application - Global Solder Ball Packaging Material Market Size, 2022 & 2029
5.1.2 BGA
5.1.3 CSP & WLCSP
5.1.4 Flip-Chip & Others
5.2 By Application - Global Solder Ball Packaging Material Revenue & Forecasts
5.2.1 By Application - Global Solder Ball Packaging Material Revenue, 2018-2023
5.2.2 By Application - Global Solder Ball Packaging Material Revenue, 2024-2029
5.2.3 By Application - Global Solder Ball Packaging Material Revenue Market Share, 2018-2029
5.3 By Application - Global Solder Ball Packaging Material Sales & Forecasts
5.3.1 By Application - Global Solder Ball Packaging Material Sales, 2018-2023
5.3.2 By Application - Global Solder Ball Packaging Material Sales, 2024-2029
5.3.3 By Application - Global Solder Ball Packaging Material Sales Market Share, 2018-2029
5.4 By Application - Global Solder Ball Packaging Material Price (Manufacturers Selling Prices), 2018-2029
6 Sights by Region
6.1 By Region - Global Solder Ball Packaging Material Market Size, 2022 & 2029
6.2 By Region - Global Solder Ball Packaging Material Revenue & Forecasts
6.2.1 By Region - Global Solder Ball Packaging Material Revenue, 2018-2023
6.2.2 By Region - Global Solder Ball Packaging Material Revenue, 2024-2029
6.2.3 By Region - Global Solder Ball Packaging Material Revenue Market Share, 2018-2029
6.3 By Region - Global Solder Ball Packaging Material Sales & Forecasts
6.3.1 By Region - Global Solder Ball Packaging Material Sales, 2018-2023
6.3.2 By Region - Global Solder Ball Packaging Material Sales, 2024-2029
6.3.3 By Region - Global Solder Ball Packaging Material Sales Market Share, 2018-2029
6.4 North America
6.4.1 By Country - North America Solder Ball Packaging Material Revenue, 2018-2029
6.4.2 By Country - North America Solder Ball Packaging Material Sales, 2018-2029
6.4.3 US Solder Ball Packaging Material Market Size, 2018-2029
6.4.4 Canada Solder Ball Packaging Material Market Size, 2018-2029
6.4.5 Mexico Solder Ball Packaging Material Market Size, 2018-2029
6.5 Europe
6.5.1 By Country - Europe Solder Ball Packaging Material Revenue, 2018-2029
6.5.2 By Country - Europe Solder Ball Packaging Material Sales, 2018-2029
6.5.3 Germany Solder Ball Packaging Material Market Size, 2018-2029
6.5.4 France Solder Ball Packaging Material Market Size, 2018-2029
6.5.5 U.K. Solder Ball Packaging Material Market Size, 2018-2029
6.5.6 Italy Solder Ball Packaging Material Market Size, 2018-2029
6.5.7 Russia Solder Ball Packaging Material Market Size, 2018-2029
6.5.8 Nordic Countries Solder Ball Packaging Material Market Size, 2018-2029
6.5.9 Benelux Solder Ball Packaging Material Market Size, 2018-2029
6.6 Asia
6.6.1 By Region - Asia Solder Ball Packaging Material Revenue, 2018-2029
6.6.2 By Region - Asia Solder Ball Packaging Material Sales, 2018-2029
6.6.3 China Solder Ball Packaging Material Market Size, 2018-2029
6.6.4 Japan Solder Ball Packaging Material Market Size, 2018-2029
6.6.5 South Korea Solder Ball Packaging Material Market Size, 2018-2029
6.6.6 Southeast Asia Solder Ball Packaging Material Market Size, 2018-2029
6.6.7 India Solder Ball Packaging Material Market Size, 2018-2029
6.7 South America
6.7.1 By Country - South America Solder Ball Packaging Material Revenue, 2018-2029
6.7.2 By Country - South America Solder Ball Packaging Material Sales, 2018-2029
6.7.3 Brazil Solder Ball Packaging Material Market Size, 2018-2029
6.7.4 Argentina Solder Ball Packaging Material Market Size, 2018-2029
6.8 Middle East & Africa
6.8.1 By Country - Middle East & Africa Solder Ball Packaging Material Revenue, 2018-2029
6.8.2 By Country - Middle East & Africa Solder Ball Packaging Material Sales, 2018-2029
6.8.3 Turkey Solder Ball Packaging Material Market Size, 2018-2029
6.8.4 Israel Solder Ball Packaging Material Market Size, 2018-2029
6.8.5 Saudi Arabia Solder Ball Packaging Material Market Size, 2018-2029
6.8.6 UAE Solder Ball Packaging Material Market Size, 2018-2029
7 Manufacturers & Brands Profiles
7.1 Senju Metal
7.1.1 Senju Metal Company Summary
7.1.2 Senju Metal Business Overview
7.1.3 Senju Metal Solder Ball Packaging Material Major Product Offerings
7.1.4 Senju Metal Solder Ball Packaging Material Sales and Revenue in Global (2018-2023)
7.1.5 Senju Metal Key News & Latest Developments
7.2 DS HiMetal
7.2.1 DS HiMetal Company Summary
7.2.2 DS HiMetal Business Overview
7.2.3 DS HiMetal Solder Ball Packaging Material Major Product Offerings
7.2.4 DS HiMetal Solder Ball Packaging Material Sales and Revenue in Global (2018-2023)
7.2.5 DS HiMetal Key News & Latest Developments
7.3 MKE
7.3.1 MKE Company Summary
7.3.2 MKE Business Overview
7.3.3 MKE Solder Ball Packaging Material Major Product Offerings
7.3.4 MKE Solder Ball Packaging Material Sales and Revenue in Global (2018-2023)
7.3.5 MKE Key News & Latest Developments
7.4 YCTC
7.4.1 YCTC Company Summary
7.4.2 YCTC Business Overview
7.4.3 YCTC Solder Ball Packaging Material Major Product Offerings
7.4.4 YCTC Solder Ball Packaging Material Sales and Revenue in Global (2018-2023)
7.4.5 YCTC Key News & Latest Developments
7.5 Nippon Micrometal
7.5.1 Nippon Micrometal Company Summary
7.5.2 Nippon Micrometal Business Overview
7.5.3 Nippon Micrometal Solder Ball Packaging Material Major Product Offerings
7.5.4 Nippon Micrometal Solder Ball Packaging Material Sales and Revenue in Global (2018-2023)
7.5.5 Nippon Micrometal Key News & Latest Developments
7.6 Accurus
7.6.1 Accurus Company Summary
7.6.2 Accurus Business Overview
7.6.3 Accurus Solder Ball Packaging Material Major Product Offerings
7.6.4 Accurus Solder Ball Packaging Material Sales and Revenue in Global (2018-2023)
7.6.5 Accurus Key News & Latest Developments
7.7 PMTC
7.7.1 PMTC Company Summary
7.7.2 PMTC Business Overview
7.7.3 PMTC Solder Ball Packaging Material Major Product Offerings
7.7.4 PMTC Solder Ball Packaging Material Sales and Revenue in Global (2018-2023)
7.7.5 PMTC Key News & Latest Developments
7.8 Shanghai hiking solder material
7.8.1 Shanghai hiking solder material Company Summary
7.8.2 Shanghai hiking solder material Business Overview
7.8.3 Shanghai hiking solder material Solder Ball Packaging Material Major Product Offerings
7.8.4 Shanghai hiking solder material Solder Ball Packaging Material Sales and Revenue in Global (2018-2023)
7.8.5 Shanghai hiking solder material Key News & Latest Developments
7.9 Shenmao Technology
7.9.1 Shenmao Technology Company Summary
7.9.2 Shenmao Technology Business Overview
7.9.3 Shenmao Technology Solder Ball Packaging Material Major Product Offerings
7.9.4 Shenmao Technology Solder Ball Packaging Material Sales and Revenue in Global (2018-2023)
7.9.5 Shenmao Technology Key News & Latest Developments
7.10 Indium Corporation
7.10.1 Indium Corporation Company Summary
7.10.2 Indium Corporation Business Overview
7.10.3 Indium Corporation Solder Ball Packaging Material Major Product Offerings
7.10.4 Indium Corporation Solder Ball Packaging Material Sales and Revenue in Global (2018-2023)
7.10.5 Indium Corporation Key News & Latest Developments
7.11 Jovy Systems
7.11.1 Jovy Systems Company Summary
7.11.2 Jovy Systems Solder Ball Packaging Material Business Overview
7.11.3 Jovy Systems Solder Ball Packaging Material Major Product Offerings
7.11.4 Jovy Systems Solder Ball Packaging Material Sales and Revenue in Global (2018-2023)
7.11.5 Jovy Systems Key News & Latest Developments
8 Global Solder Ball Packaging Material Production Capacity, Analysis
8.1 Global Solder Ball Packaging Material Production Capacity, 2018-2029
8.2 Solder Ball Packaging Material Production Capacity of Key Manufacturers in Global Market
8.3 Global Solder Ball Packaging Material Production by Region
9 Key Market Trends, Opportunity, Drivers and Restraints
9.1 Market Opportunities & Trends
9.2 Market Drivers
9.3 Market Restraints
10 Solder Ball Packaging Material Supply Chain Analysis
10.1 Solder Ball Packaging Material Industry Value Chain
10.2 Solder Ball Packaging Material Upstream Market
10.3 Solder Ball Packaging Material Downstream and Clients
10.4 Marketing Channels Analysis
10.4.1 Marketing Channels
10.4.2 Solder Ball Packaging Material Distributors and Sales Agents in Global
11 Conclusion
12 Appendix
12.1 Note
12.2 Examples of Clients
12.3 Disclaimer
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