Chiplet Packaging Technology - Global and China Top Players Market Share and Ranking 2023
Report Code: KNJ1569799 No. of Pages: 146 Category: Services
Publisher: Date of Publish:
Publisher: Date of Publish:
According to YH Research, the global market for Chiplet Packaging Technology should grow from US$ million in 2022 to US$ million by 2029, with a CAGR of % for the period of 2023-2029.
By country, China accounted for percent of the global market last year and China’s market share increased from percent to percent. China Chiplet Packaging Technology market should grow from US$ million in 2022 to US$ million by 2029, with a CAGR of % for the period of 2023-2029. The United States Chiplet Packaging Technology market should grow from US$ million in 2022 to US$ million by 2029, with a CAGR of % for the period of 2023-2029.
By segment, GPU grew percent to account for percent of the total market sales, and CPU grew percent.
This report studies and analyses global Chiplet Packaging Technology status and future trends, to help determine the Chiplet Packaging Technology market size of the total market opportunity by Type, by Application, by company, and by region & country. This report is a detailed and comprehensive analysis of the world market for Chiplet Packaging Technology, and provides market size (US$ million) and Year-over-Year growth, considering 2022 as the base year.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
To assess the competitive environment within the market including supplier revenue, market share, and company profiles.
Highlights
(1) Global Chiplet Packaging Technology market size, history data 2018-2023, and forecast data 2024-2029, (US$ million)
(2) Global Chiplet Packaging Technology by company, revenue, market share and industry ranking 2018-2023, (US$ million)
(3) China Chiplet Packaging Technology by company, revenue, market share and industry ranking 2018-2023, (US$ million)
(4) Global Chiplet Packaging Technology key consuming regions, consumption value and demand structure
(5) Chiplet Packaging Technology industry chains, upstream, midstream and downstream
Market segment by players, this report covers
AMD
Intel
Marvell
TSMC
NVIDIA
Tongfu Microelectronics
Northrop Grumman
Jiangsu Dagang
Cambrian
Tianshui Huatian Technology
JCET Group
Samsung
ARM
ASE Group
Market segment by Type, covers
2D Packaging Technology
2.5D Packaging Technology
3D Packaging Technology
Market segment by Application, can be divided into
GPU
CPU
ISP
NPU
VPU
Others
Market segment by regions, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, UK, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, South Korea, India, Southeast Asia, Australia, and Rest of Asia-Pacific)
South America (Brazil, Rest of South America)
Middle East & Africa
Report Includes:
Chapter 1: to describe Chiplet Packaging Technology product scope, global consumption value, China consumption value, development opportunities, challenges, trends, and policies.
Chapter 2: Global Chiplet Packaging Technology market share and ranking of major manufacturers, revenue, 2018-2023
Chapter 3: China Chiplet Packaging Technology market share and ranking of major manufacturers, revenue, 2018-2023
Chapter 4: Chiplet Packaging Technology industry chain, upstream, medium-stream, and downstream.
Chapter 5: Segment by Type, consumption value, percent & CAGR, 2018-2029
Chapter 6: Segment by Application, consumption value, percent & CAGR, 2018-2029
Chapter 7: Segment in regional level, consumption value, percent & CAGR, 2018-2029
Chapter 8: Segment in country level, consumption value, percent & CAGR, 2018-2029
Chapter 9: Company profile, introducing the basic situation of the main companies in the market in detail, including product specifications, application, recent development, revenue, gross margin.
Chapter 10: Conclusions
1 Market Overview
1.1 Chiplet Packaging Technology Definition
1.2 Global Chiplet Packaging Technology Market Size and Forecast
1.3 China Chiplet Packaging Technology Market Size and Forecast
1.4 China Percentage in Global Market
1.5 Chiplet Packaging Technology Market Size: China VS Global Growth Rate, 2018-2029
1.6 Chiplet Packaging Technology Market Dynamics
1.6.1 Chiplet Packaging Technology Market Drivers
1.6.2 Chiplet Packaging Technology Market Restraints
1.6.3 Chiplet Packaging Technology Industry Trends
1.6.4 Chiplet Packaging Technology Industry Policy
2 Global Leading Players and Market Share
2.1 By Revenue of Chiplet Packaging Technology, Global Market Share by Company, 2018-2023
2.2 Global Chiplet Packaging Technology Participants, Market Position (Tier 1, Tier 2, and Tier 3)
2.3 Global Chiplet Packaging Technology Concentration Ratio
2.4 Global Chiplet Packaging Technology Mergers & Acquisitions, Expansion Plans
2.5 Global Chiplet Packaging Technology Major Companies Product Type
2.6 Head Office and Chiplet Packaging Technology Production Site of Key Manufacturer
3 China Leading Players, Market Share and Ranking
3.1 By Revenue of Chiplet Packaging Technology, China Market Share by Company, 2018-2023
3.2 China Chiplet Packaging Technology Participants, Market Position (Tier 1, Tier 2, and Tier 3)
4 Industry Chain Analysis
4.1 Chiplet Packaging Technology Industry Chain
4.2 Chiplet Packaging Technology Upstream Analysis
4.2.1 Chiplet Packaging Technology Core Raw Materials
4.2.2 Main Manufacturers of Chiplet Packaging Technology Core Raw Materials
4.3 Midstream Analysis
4.4 Downstream Analysis
4.5 Chiplet Packaging Technology Production Mode
4.6 Chiplet Packaging Technology Procurement Model
4.7 Chiplet Packaging Technology Industry Sales Model and Sales Channels
4.7.1 Chiplet Packaging Technology Sales Model
4.7.2 Chiplet Packaging Technology Typical Distributors
5 Sights by Type
5.1 Chiplet Packaging Technology Classification
5.1.1 2D Packaging Technology
5.1.2 2.5D Packaging Technology
5.1.3 3D Packaging Technology
5.2 By Type, Global Chiplet Packaging Technology Consumption Value & CAGR, 2018 VS 2022 VS 2029
5.3 By Type, Global Chiplet Packaging Technology Consumption Value, 2018-2029
6 Sights by Application
6.1 Chiplet Packaging Technology Segment by Application
6.1.1 GPU
6.1.2 CPU
6.1.3 ISP
6.1.4 NPU
6.1.5 VPU
6.1.6 Others
6.2 By Application, Global Chiplet Packaging Technology Consumption Value & CAGR, 2018 VS 2022 VS 2029
6.3 By Application, Global Chiplet Packaging Technology Consumption Value, 2018-2029
7 Sales Sights by Region
7.1 By Region, Global Chiplet Packaging Technology Consumption Value, 2018 VS 2022 VS 2029
7.2 By Region, Global Chiplet Packaging Technology Consumption Value, 2018-2029
7.3 North America
7.3.1 North America Chiplet Packaging Technology & Forecasts, 2018-2029
7.3.2 By Country, North America Chiplet Packaging Technology Market Size Market Share
7.4 Europe
7.4.1 Europe Chiplet Packaging Technology Market Size & Forecasts, 2018-2029
7.4.2 By Country, Europe Chiplet Packaging Technology Market Size Market Share
7.5 Asia Pacific
7.5.1 Asia Pacific Chiplet Packaging Technology Market Size & Forecasts, 2018-2029
7.5.2 By Country/Region, Asia Pacific Chiplet Packaging Technology Market Size Market Share
7.6 South America
7.6.1 South America Chiplet Packaging Technology Market Size & Forecasts, 2018-2029
7.6.2 By Country, South America Chiplet Packaging Technology Market Size Market Share
7.7 Middle East & Africa
8 Sales Sights by Country Level
8.1 By Country, Global Chiplet Packaging Technology Market Size & CAGR, 2018 VS 2022 VS 2029
8.2 By Country, Global Chiplet Packaging Technology Consumption Value, 2018-2029
8.3 U.S.
8.3.1 U.S. Chiplet Packaging Technology Market Size, 2018-2029
8.3.2 By Type, U.S. Chiplet Packaging Technology Consumption Value Market Share, 2022 VS 2029
8.3.3 By Application, U.S. Chiplet Packaging Technology Consumption Value Market Share, 2022 VS 2029
8.4 Europe
8.4.1 Europe Chiplet Packaging Technology Market Size, 2018-2029
8.4.2 By Type, Europe Chiplet Packaging Technology Consumption Value Market Share, 2022 VS 2029
8.4.3 By Application, Europe Chiplet Packaging Technology Consumption Value Market Share, 2022 VS 2029
8.5 China
8.5.1 China Chiplet Packaging Technology Market Size, 2018-2029
8.5.2 By Type, China Chiplet Packaging Technology Consumption Value Market Share, 2022 VS 2029
8.5.3 By Application, China Chiplet Packaging Technology Consumption Value Market Share, 2022 VS 2029
8.6 Japan
8.6.1 Japan Chiplet Packaging Technology Market Size, 2018-2029
8.6.2 By Type, Japan Chiplet Packaging Technology Consumption Value Market Share, 2022 VS 2029
8.6.3 By Application, Japan Chiplet Packaging Technology Consumption Value Market Share, 2022 VS 2029
8.7 South Korea
8.7.1 South Korea Chiplet Packaging Technology Market Size, 2018-2029
8.7.2 By Type, South Korea Chiplet Packaging Technology Consumption Value Market Share, 2022 VS 2029
8.7.3 By Application, South Korea Chiplet Packaging Technology Consumption Value Market Share, 2022 VS 2029
8.8 Southeast Asia
8.8.1 Southeast Asia Chiplet Packaging Technology Market Size, 2018-2029
8.8.2 By Type, Southeast Asia Chiplet Packaging Technology Consumption Value Market Share, 2022 VS 2029
8.8.3 By Application, Southeast Asia Chiplet Packaging Technology Consumption Value Market Share, 2022 VS 2029
8.9 India
8.9.1 India Chiplet Packaging Technology Market Size, 2018-2029
8.9.2 By Type, India Chiplet Packaging Technology Consumption Value Market Share, 2022 VS 2029
8.9.3 By Application, India Chiplet Packaging Technology Consumption Value Market Share, 2022 VS 2029
8.10 Middle East & Africa
8.10.1 Middle East & Africa Chiplet Packaging Technology Market Size, 2018-2029
8.10.2 By Type, Middle East & Africa Chiplet Packaging Technology Consumption Value Market Share, 2022 VS 2029
8.10.3 By Application, Middle East & Africa Chiplet Packaging Technology Consumption Value Market Share, 2022 VS 2029
9 Company Profile
9.1 AMD
9.1.1 AMD Company Information, Head Office, Market Area and Industry Position
9.1.2 AMD Company Profile and Main Business
9.1.3 AMD Chiplet Packaging Technology Models, Specifications and Application
9.1.4 AMD Chiplet Packaging Technology Revenue and Gross Margin, 2018-2023
9.1.5 AMD Recent Developments
9.2 Intel
9.2.1 Intel Company Information, Head Office, Market Area and Industry Position
9.2.2 Intel Company Profile and Main Business
9.2.3 Intel Chiplet Packaging Technology Models, Specifications and Application
9.2.4 Intel Chiplet Packaging Technology Revenue and Gross Margin, 2018-2023
9.2.5 Intel Recent Developments
9.3 Marvell
9.3.1 Marvell Company Information, Head Office, Market Area and Industry Position
9.3.2 Marvell Company Profile and Main Business
9.3.3 Marvell Chiplet Packaging Technology Models, Specifications and Application
9.3.4 Marvell Chiplet Packaging Technology Revenue and Gross Margin, 2018-2023
9.3.5 Marvell Recent Developments
9.4 TSMC
9.4.1 TSMC Company Information, Head Office, Market Area and Industry Position
9.4.2 TSMC Company Profile and Main Business
9.4.3 TSMC Chiplet Packaging Technology Models, Specifications and Application
9.4.4 TSMC Chiplet Packaging Technology Revenue and Gross Margin, 2018-2023
9.4.5 TSMC Recent Developments
9.5 NVIDIA
9.5.1 NVIDIA Company Information, Head Office, Market Area and Industry Position
9.5.2 NVIDIA Company Profile and Main Business
9.5.3 NVIDIA Chiplet Packaging Technology Models, Specifications and Application
9.5.4 NVIDIA Chiplet Packaging Technology Revenue and Gross Margin, 2018-2023
9.5.5 NVIDIA Recent Developments
9.6 Tongfu Microelectronics
9.6.1 Tongfu Microelectronics Company Information, Head Office, Market Area and Industry Position
9.6.2 Tongfu Microelectronics Company Profile and Main Business
9.6.3 Tongfu Microelectronics Chiplet Packaging Technology Models, Specifications and Application
9.6.4 Tongfu Microelectronics Chiplet Packaging Technology Revenue and Gross Margin, 2018-2023
9.6.5 Tongfu Microelectronics Recent Developments
9.7 Northrop Grumman
9.7.1 Northrop Grumman Company Information, Head Office, Market Area and Industry Position
9.7.2 Northrop Grumman Company Profile and Main Business
9.7.3 Northrop Grumman Chiplet Packaging Technology Models, Specifications and Application
9.7.4 Northrop Grumman Chiplet Packaging Technology Revenue and Gross Margin, 2018-2023
9.7.5 Northrop Grumman Recent Developments
9.8 Jiangsu Dagang
9.8.1 Jiangsu Dagang Company Information, Head Office, Market Area and Industry Position
9.8.2 Jiangsu Dagang Company Profile and Main Business
9.8.3 Jiangsu Dagang Chiplet Packaging Technology Models, Specifications and Application
9.8.4 Jiangsu Dagang Chiplet Packaging Technology Revenue and Gross Margin, 2018-2023
9.8.5 Jiangsu Dagang Recent Developments
9.9 Cambrian
9.9.1 Cambrian Company Information, Head Office, Market Area and Industry Position
9.9.2 Cambrian Company Profile and Main Business
9.9.3 Cambrian Chiplet Packaging Technology Models, Specifications and Application
9.9.4 Cambrian Chiplet Packaging Technology Revenue and Gross Margin, 2018-2023
9.9.5 Cambrian Recent Developments
9.10 Tianshui Huatian Technology
9.10.1 Tianshui Huatian Technology Company Information, Head Office, Market Area and Industry Position
9.10.2 Tianshui Huatian Technology Company Profile and Main Business
9.10.3 Tianshui Huatian Technology Chiplet Packaging Technology Models, Specifications and Application
9.10.4 Tianshui Huatian Technology Chiplet Packaging Technology Revenue and Gross Margin, 2018-2023
9.10.5 Tianshui Huatian Technology Recent Developments
9.11 JCET Group
9.11.1 JCET Group Company Information, Head Office, Market Area and Industry Position
9.11.2 JCET Group Company Profile and Main Business
9.11.3 JCET Group Chiplet Packaging Technology Models, Specifications and Application
9.11.4 JCET Group Chiplet Packaging Technology Revenue and Gross Margin, 2018-2023
9.11.5 JCET Group Recent Developments
9.12 Samsung
9.12.1 Samsung Company Information, Head Office, Market Area and Industry Position
9.12.2 Samsung Company Profile and Main Business
9.12.3 Samsung Chiplet Packaging Technology Models, Specifications and Application
9.12.4 Samsung Chiplet Packaging Technology Revenue and Gross Margin, 2018-2023
9.12.5 Samsung Recent Developments
9.13 ARM
9.13.1 ARM Company Information, Head Office, Market Area and Industry Position
9.13.2 ARM Company Profile and Main Business
9.13.3 ARM Chiplet Packaging Technology Models, Specifications and Application
9.13.4 ARM Chiplet Packaging Technology Revenue and Gross Margin, 2018-2023
9.13.5 ARM Recent Developments
9.14 ASE Group
9.14.1 ASE Group Company Information, Head Office, Market Area and Industry Position
9.14.2 ASE Group Company Profile and Main Business
9.14.3 ASE Group Chiplet Packaging Technology Models, Specifications and Application
9.14.4 ASE Group Chiplet Packaging Technology Revenue and Gross Margin, 2018-2023
9.14.5 ASE Group Recent Developments
10 Conclusion
11 Appendix
11.1 Research Methodology
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Market Estimation Model
11.4 Disclaimer
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